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Seitenansicht 69
REF: BB_SRM_xM BeagleBoard-xM System
Reference Manual
Revision A2
Page 70 of 164
8.11 POP Memory Device
The processor uses what is called POP (Package-on-Package) memory. The memory is a
MCP (Multi Chip Package) that contains a dual Mobile DDR SDRAM stack. Figure 33
shows the POP Memory concept.
Figure 33. POP Memory
The Memory device mounts on top of the processor. The configuration used on the board
is a 200MHz 4Gb MDDR SDRAM device from Micron.
8.12 System Clocks
There are three main clocks needed for the operation of the board, 32KHz, 26MHz and
McBSP_CLKS. Figure 34 shows the components that make up the System Clocks.
There are additional clocks needed elsewhere in the system, such as USB HUB, but those
are discussed in separate sections.
U4BOMAP3730_ES1.0
SY S_XTALIN
AE17
SYS_32K
AE25
SY S_CLKREQ/GPIO_1
AF25
McBSP_CLKS
T21
U7A TPS65950
32KCLKOUT
N10
32KXIN
P16
32KXOUT
P15
HFCLKIN
A14
HFCLKOUT
R12
CLKEN
C6
CLKEN2
D7
CLKREQ
G10
CLK256FS
D13
CLK256FS
HFCLK_26MHz
OSC_EN
R51 33
R47 33
HFCLKOUT
T2_XOU T
C102 22PF
T2_XIN
C103 22PF
Y3
32KHz Cry stal
1 2
C85 0.1uF,10V
VIO_1V8
Y1
OSC_26MHZ_EAE
COM/CASE
2
NC
1
+VCC
4
OUT
3
26MHZ
R56 33
R55 4.7K
OSC_EN
Figure 34. System Clocks
Processor
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